NXP USA Inc. 74HC02N

表面安装

NO

终端数量

14

Package Description

DIP, DIP14,.3

Package Style

IN-LINE

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

74HC02N

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

4.48

Prop.

23 ns

JESD-609代码

e4

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T14

资历状况

不合格

电源

2/6 V

温度等级

INDUSTRIAL

逻辑IC类型

NOR GATE

最大 I(ol)

0.004 A

施密特触发器

NO