NXP USA Inc. 74HCT154DB

表面安装

YES

终端数量

24

Package Description

SSOP, SSOP24,.3

Package Style

SMALL OUTLINE, SHRINK PITCH

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SSOP24,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

74HCT154DB

Supply Voltage-Nom (Vsup)

5 V

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.71

Prop.

53 ns

子类别

Decoder/Drivers

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

功能数量

1

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G24

资历状况

不合格

电源

5 V

温度等级

AUTOMOTIVE

逻辑IC类型

OTHER DECODER/DRIVER

最大 I(ol)

0.004 A