NXP USA Inc. BLS2731-20114

表面安装

YES

终端数量

2

晶体管元件材料

SILICON

Package Description

FLANGE MOUNT, R-CDFM-F2

Package Style

FLANGE MOUNT

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Manufacturer Package Code

SOT445C

Manufacturer Part Number

BLS2731-20,114

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.63

Part Package Code

DFM

附加功能

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

HTS代码

8541.29.00.75

端子位置

DUAL

终端形式

FLAT

Reach合规守则

unknown

引脚数量

2

JESD-30代码

R-CDFM-F2

资历状况

不合格

Brand Name

恩智浦半导体

配置

SINGLE

箱体转运

BASE

晶体管应用

AMPLIFIER

极性/通道类型

NPN

最高频段

S带