NXP USA Inc. CBT16211DL

表面安装

YES

终端数量

56

Package Description

SSOP, SSOP56,.4

Package Style

SMALL OUTLINE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SSOP56,.4

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

CBT16211DL

Supply Voltage-Nom (Vsup)

5 V

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.69

子类别

Bus Driver/Transceivers

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G56

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL

逻辑IC类型

总线驱动器