NXP USA Inc. CBT16212DGG

表面安装

YES

终端数量

56

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP56,.3,20

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

CBT16212DGG

Supply Voltage-Nom (Vsup)

5 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

8.63

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn85Pb15)

子类别

其他逻辑IC

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

not_compliant

JESD-30代码

R-PDSO-G56

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL