NXP USA Inc. CBTV4010EE

表面安装

YES

终端数量

64

Package Description

FBGA, BGA64,11X11,20

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA64,11X11,20

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

CBTV4010EE

Supply Voltage-Nom (Vsup)

2.5 V

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.81

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Bus Driver/Transceivers

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B64

资历状况

不合格

电源

2.5 V

温度等级

OTHER

逻辑IC类型

总线驱动器