Philips Semiconductors BCP55
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BCP55详情
Philips Semiconductors BCP55重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
表面安装
YES
外壳材料
1
Gross Weight
23.00
Transport Packing Size/Quantity
42*28*18.5/400
Incog Cable Diameter
6min
Body Diameter
19 mm
Compatible Parts
plug XLR - JD-357 (AUD-71) and others.
Rohs Code
有
Part Life Cycle Code
Transferred
Ihs Manufacturer
飞利浦半导体
Operating Temperature-Max
150 °C
JESD-609代码
e3
ECCN 代码
EAR99
类型
3-pole cable microphone socket
端子表面处理
哑光锡
峰值回流焊温度(摄氏度)
260
深度
88 mm
Reach合规守则
unknown
配置
SINGLE
极性/通道类型
NPN
最大耗散功率(Abs)
1.5 W
集电极电流-最大值(IC)
1 A
最小直流增益(hFE)
40
BCP55拓展信息
North American Philips Discrete Products Div
Philips Semiconductors
Philips Semiconductors
Philips Semiconductors
Philips Semiconductors
North American Philips Discrete Products Div
Philips Semiconductors
North American Philips Discrete Products Div
North American Philips Discrete Products Div
Philips Semiconductors








哦! 它是空的。