Philips Semiconductors SA57608BD

表面安装

YES

终端数量

6

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

TSOP, TSOP6,.11,37

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSOP

Package Equivalence Code

TSOP6,.11,37

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE

JESD-609代码

e0

ECCN 代码

EAR99

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

0.95 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G6

资历状况

不合格

温度等级

INDUSTRIAL

供应电流-最大值(Isup)

8 mA