Philips Semiconductors TDA10021

表面安装

YES

终端数量

64

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

QFP, QFP64,.47SQ,20

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

QFP

Package Equivalence Code

QFP64,.47SQ,20

Package Shape

SQUARE

Package Style

FLATPACK

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PQFP-G64

资历状况

不合格

温度等级

COMMERCIAL