Philips Semiconductors TSA5511

表面安装

NO

终端数量

18

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

DIP, DIP18,.3

Operating Temperature-Max

80 °C

Operating Temperature-Min

-10 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP18,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T18

资历状况

不合格

温度等级

商业扩展

供应电流-最大值(Isup)

50 mA