Philips Semicons 74LV157PW

表面安装

YES

终端数量

16

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP16,.25

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Prop.

30 ns

Supply Voltage-Nom (Vsup)

3.3 V

Load Capacitance (CL)

50 pF

Risk Rank

8.16

Package Description

TSSOP, TSSOP16,.25

Ihs Manufacturer

飞利浦半导体

Part Life Cycle Code

Transferred

Rohs Code

无

Manufacturer Part Number

74LV157PW

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

鸥翼

功能数量

4

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

3.3 V

温度等级

AUTOMOTIVE

输入数量

2

逻辑IC类型

MULTIPLEXER

最大 I(ol)

0.006 A