Renesas Electronics HD74LV00AFP-E

表面安装

YES

终端数量

14

ECCN (US)

EAR99

Logic Family

LV

Number of Elements per Chip

4

Number of Element Inputs

2-IN

Number of Output Enables per Element

0

Number of Selection Inputs per Element

0

Number of Element Outputs

1

Maximum Propagation Delay Time @ Maximum CL (ns)

7.5@5V|[email protected]|[email protected]

Absolute Propagation Delay Time (ns)

20

Process Technology

CMOS

Maximum Low Level Output Current (mA)

12

Maximum High Level Output Current (mA)

-12

Minimum Operating Supply Voltage (V)

2

Typical Operating Supply Voltage (V)

5|2.5|3.3

Maximum Operating Supply Voltage (V)

5.5

Maximum Quiescent Current (uA)

20

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Standard Package Name

SOP

Supplier Package

SOP

Mounting

表面贴装

Package Height

2(Max)

Package Length

10.06

Package Width

5.5

PCB changed

14

Lead Shape

Gull-wing

Package Description

FP-14DAV

Package Style

小概要

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

20

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

HD74LV00AFP-E

Supply Voltage-Nom (Vsup)

2.5 V

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

Part Life Cycle Code

活跃

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Risk Rank

5.19

Part Package Code

SOIC

无铅代码

有

零件状态

活跃

HTS代码

8542.39.00.01

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

4

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

14

JESD-30代码

R-PDSO-G14

资历状况

不合格

电源电压-最大值(Vsup)

5.5 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2 V

家人

LV/LV-A/LVX/H

逻辑功能

NAND

输入数量

2

座位高度-最大

2.2 mm

逻辑IC类型

NAND GATE

传播延迟(tpd)

20 ns

宽度

5.5 mm

长度

10.06 mm

RoHS状态

符合RoHS标准