参数名
参数值
参数名
参数值
表面安装
YES
终端数量
5
Process Technology
CMOS
Input Signal Type
Single-Ended
Maximum Low Level Output Current (mA)
12
Maximum High Level Output Current (mA)
-12
Minimum Operating Supply Voltage (V)
1.65
Typical Operating Supply Voltage (V)
5|1.8|2.5|3.3
Maximum Operating Supply Voltage (V)
5.5
Maximum Quiescent Current (uA)
10
Propagation Delay Test Condition (pF)
50
Maximum Power Dissipation (mW)
200
Minimum Operating Temperature (°C)
-40
Absolute Propagation Delay Time (ns)
38
Maximum Propagation Delay Time @ Maximum CL (ns)
[email protected]|7.5@5V|[email protected]|[email protected]
Bus Hold
无
Number of Output Enables per Chip
1 Low
Number of Outputs per Chip
1
Number of Input Enables per Chip
0
Number of Inputs per Chip
1
Number of Channels per Chip
1
Number of Elements per Chip
1
Logic Family
LV
ECCN (US)
EAR99
Lead Shape
Gull-wing
PCB changed
5
Package Width
1.25
Package Length
2
Package Height
0.9
Mounting
表面贴装
Supplier Package
CMPAK
Standard Package Name
SC-88A
Maximum Operating Temperature (°C)
85
RoHS
Non-Compliant
Package Description
TSSOP,
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Moisture Sensitivity Levels
1
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Min
-40 °C
Reflow Temperature-Max (s)
20
Operating Temperature-Max
85 °C
Rohs Code
有
Manufacturer Part Number
HD74LV1G125ACME-E
Supply Voltage-Nom (Vsup)
1.8 V
Package Code
TSSOP
Package Shape
RECTANGULAR
Manufacturer
Renesas Electronics Corporation
Part Life Cycle Code
不推荐
Ihs Manufacturer
RENESAS ELECTRONICS CORP
Risk Rank
5.34
Part Package Code
SOIC
包装
卷带
JESD-609代码
e6
无铅代码
有
零件状态
活跃
端子表面处理
锡铋
HTS代码
8542.39.00.01
技术
CMOS
端子位置
DUAL
终端形式
鸥翼
峰值回流焊温度(摄氏度)
260
功能数量
1
端子间距
0.65 mm
Reach合规守则
compliant
引脚数量
5
JESD-30代码
R-PDSO-G5
资历状况
不合格
输出类型
3-State
极性
Non-Inverting
电源电压-最大值(Vsup)
5.5 V
温度等级
INDUSTRIAL
电源电压-最小值(Vsup)
1.65 V
端口的数量
2
比特数
1
家人
LV/LV-A/LVX/H
逻辑功能
Buffer/Line Driver
输出特性
3-STATE
座位高度-最大
1.1 mm
输出极性
TRUE
逻辑IC类型
总线驱动器
传播延迟(tpd)
36 ns
宽度
1.25 mm
长度
2 mm
RoHS状态
符合RoHS标准