参数名
参数值
参数名
参数值
表面安装
YES
终端数量
20
ECCN (US)
EAR99
Logic Family
LV
Number of Elements per Chip
2
Number of Channels per Chip
8
Number of Inputs per Chip
8
Number of Input Enables per Chip
0
Number of Outputs per Chip
8
Number of Output Enables per Chip
2 Low
Bus Hold
无
Maximum Propagation Delay Time @ Maximum CL (ns)
[email protected]|7.5@5V|[email protected]
Absolute Propagation Delay Time (ns)
21
Process Technology
CMOS
Input Signal Type
Single-Ended
Maximum Low Level Output Current (mA)
16
Maximum High Level Output Current (mA)
-16
Minimum Operating Supply Voltage (V)
2
Typical Operating Supply Voltage (V)
3.3|5|2.5
Maximum Operating Supply Voltage (V)
5.5
Maximum Quiescent Current (uA)
20
Propagation Delay Test Condition (pF)
50
Maximum Power Dissipation (mW)
835
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Standard Package Name
SOP
Supplier Package
SOP
Mounting
表面贴装
Package Height
2(Max)
Package Length
12.6
Package Width
5.5
PCB changed
20
Lead Shape
Gull-wing
Package Description
SOP,
Package Style
小概要
Moisture Sensitivity Levels
1
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Min
-40 °C
Reflow Temperature-Max (s)
20
Operating Temperature-Max
85 °C
Rohs Code
有
Manufacturer Part Number
HD74LV244AFPEL-E
Supply Voltage-Nom (Vsup)
2.5 V
Package Code
SOP
Package Shape
RECTANGULAR
Manufacturer
Renesas Electronics Corporation
Part Life Cycle Code
不推荐
Ihs Manufacturer
RENESAS ELECTRONICS CORP
Risk Rank
5.49
Part Package Code
SOIC
JESD-609代码
e4
无铅代码
有
零件状态
NRND
端子表面处理
镍钯金
HTS代码
8542.39.00.01
技术
CMOS
端子位置
DUAL
终端形式
鸥翼
峰值回流焊温度(摄氏度)
260
功能数量
2
端子间距
1.27 mm
Reach合规守则
compliant
引脚数量
20
JESD-30代码
R-PDSO-G20
资历状况
不合格
输出类型
3-State
极性
Non-Inverting
电源电压-最大值(Vsup)
5.5 V
温度等级
INDUSTRIAL
电源电压-最小值(Vsup)
2 V
端口的数量
2
比特数
4
家人
LV/LV-A/LVX/H
逻辑功能
Buffer/Line Driver
输出特性
3-STATE
座位高度-最大
2.2 mm
输出极性
TRUE
逻辑IC类型
总线驱动器
传播延迟(tpd)
18 ns
宽度
5.5 mm
长度
12.6 mm
RoHS状态
RoHS non-compliant