Samsung Electronics M378A1G43DB0-CPB

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

16

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2133

Chip Configuration

512Mx8

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

920

Module Sides

Double

Number of Ranks

Dual

CAS Latency

15

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

UDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

3.9(Max)

PCB changed

288

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

288

组织结构

1Gx64

锁相环

无

自我刷新

有

模块类型

288UDIMM

RoHS状态

符合RoHS标准