Samsung Electronics M378A2K43BB1-CPB000

ECCN (US)

EAR99

HTS

8542.32.00.71

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

16

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2133

Chip Configuration

1Gx8

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

984

ECC Support

无

Number of Ranks

Dual

CAS Latency

15

Supplier Package

UDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

4.1(Max)

PCB changed

288

零件状态

LTB

引脚数量

288

组织结构

2Gx64

模块类型

288UDIMM

RoHS状态

符合RoHS标准