Samsung Electronics M378A5143DB0-CPB000

ECCN (US)

4A994.a

HTS

8542.32.00.71

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

8

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2133

Chip Configuration

512Mx8

Chip Package Type

78FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Single

CAS Latency

15

Supplier Package

FBGA

Mounting

表面贴装

Package Length

11

Package Width

7.5

PCB changed

78

零件状态

Obsolete

引脚数量

78

组织结构

512Mx64

模块类型

288UDIMM

RoHS状态

符合RoHS标准