Samsung Electronics M378A5143DB1-CRC00

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

8

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2400

Chip Configuration

512Mx8

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Single

CAS Latency

17

Supplier Package

UDIMM

Mounting

Socket

PCB changed

288

引脚数量

288

组织结构

512Mx64

模块类型

240UDIMM