Samsung Electronics M378B1G73BH0-CH9

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

16

Chip Density (bit)

4G

Data Bus Width (bit)

64

Max. Access Time (ns)

0.255

Maximum Clock Rate (MHz)

1333

Chip Configuration

512Mx8

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

880

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

9

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

UDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

1Gx64

锁相环

无

自我刷新

有

模块类型

240UDIMM

RoHS状态

符合RoHS标准