Samsung Electronics M386A4G40DM1-CRC

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

32Gbyte

Number of Chip per Module

36

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2400

Chip Configuration

2Gx4

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Quad

Number of Chip Banks

16

CAS Latency

15

Supplier Package

LRDIMM

Mounting

Socket

PCB changed

288

零件状态

Obsolete

引脚数量

288

组织结构

4Gx72

模块类型

288RDIMM

RoHS状态

符合RoHS标准