Samsung Electronics M386A8K40CM2-CVF

HTS

8473.30.11.40

Module

DRAM模块

Module Density

64Gbyte

Number of Chip per Module

36

Chip Density (bit)

16G

Data Bus Width (bit)

72

Max. Access Time (ns)

0.165

Maximum Clock Rate (MHz)

2933

Chip Configuration

4Gx4

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Supplier Temperature Grade

Extended

Module Sides

Double

ECC Support

有

Number of Ranks

Quad

Number of Chip Banks

16

CAS Latency

21

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

4.3(Max)

PCB changed

288

零件状态

活跃

引脚数量

288

组织结构

8Gx72

锁相环

无

自我刷新

有

模块类型

288LRDIMM