Samsung Electronics M386A8K40DM2-CWEB

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

64Gbyte

Number of Chip per Module

36

Chip Density (bit)

16G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2133

Chip Configuration

4Gx4

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Chip Banks

16

CAS Latency

15

零件状态

LTB

组织结构

8Gx72

模块类型

288RDIMM

RoHS状态

符合RoHS标准