Samsung Electronics M386B4G70DM0-CMA

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

32Gbyte

Number of Chip per Module

36

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1866

Chip Configuration

2Gx4

Chip Package Type

78FBGA

Typical Operating Supply Voltage (V)

1.5

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Quad

CAS Latency

13

Supplier Package

LRDIMM

Mounting

Socket

Package Height

30.35

Package Length

133.35

Package Width

4.8(Max)

PCB changed

240

零件状态

Obsolete

引脚数量

240

组织结构

4Gx72

模块类型

240LRDIMM