Samsung Electronics M391A2K43BB1-CPB

ECCN (US)

EAR99

HTS

8542.32.00.71

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

18

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2133

Chip Configuration

1Gx8

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

1125

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

Number of Chip Banks

16

CAS Latency

15

SPD EEPROM Support

无

Supplier Package

UDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

3.9(Max)

PCB changed

288

零件状态

活跃

引脚数量

288

组织结构

2Gx72

锁相环

无

自我刷新

有

模块类型

288UDIMM

RoHS状态

符合RoHS标准