Samsung Electronics M391B1G73EB0-YK0

ECCN (US)

4A994.a

HTS

8473.30.51.00

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

18

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Chip Package Type

78FBGA

Typical Operating Supply Voltage (V)

1.35

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

ECC Support

有

Number of Ranks

Dual

CAS Latency

11

Supplier Package

UDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

零件状态

Obsolete

引脚数量

240

组织结构

1Gx64

模块类型

240UDIMM

RoHS状态

符合RoHS标准