Samsung Electronics M391B5173EB0-YK0

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

9

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Chip Package Type

78FBGA

Typical Operating Supply Voltage (V)

1.35

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

ECC Support

有

Number of Ranks

Single

CAS Latency

11

PC Type

PC3-12800

Supplier Package

UDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

零件状态

Obsolete

引脚数量

240

组织结构

512Mx64

模块类型

240UDIMM

RoHS状态

符合RoHS标准