Samsung Electronics M392A4K40BM0-CPB

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

32Gbyte

Number of Chip per Module

18

Chip Density (bit)

16G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1066

Chip Configuration

4Gx4

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

CAS Latency

15

SPD EEPROM Support

有

Supplier Package

VLP RDIMM

Mounting

Socket

Package Height

18.75

Package Length

133.35

Package Width

3.9(Max)

PCB changed

288

零件状态

Obsolete

引脚数量

288

组织结构

4Gx72

锁相环

无

自我刷新

无

模块类型

288VLP RDIMM

RoHS状态

符合RoHS标准