Samsung Electronics M393A1G43EB1-CTD

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

18

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

512Mx8

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

1435

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

Number of Chip Banks

16

CAS Latency

19

SPD EEPROM Support

无

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

1.4 + 2.8(Max)

PCB changed

288

零件状态

活跃

引脚数量

288

组织结构

1Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM