Samsung Electronics M393A1K43BB1-CTD

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

9

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

1Gx8

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Module Sides

Double

ECC Support

有

Number of Ranks

Single

CAS Latency

19

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

4.3(Max)

PCB changed

288

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

288

组织结构

1Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM

RoHS状态

符合RoHS标准