Samsung Electronics M393A2K40CB2-CTD

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

18

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

2Gx4

Chip Package Type

78FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

16

CAS Latency

19

Standard Package Name

DIM

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

4.3(Max)

PCB changed

288

Lead Shape

No Lead

Manufacturer Part Number

M393A2K40CB2-CTD

Manufacturer

三星半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.72

零件状态

活跃

Reach合规守则

compliant

引脚数量

288

组织结构

2Gx72

内存IC类型

DDR内存模块

模块类型

288RDIMM

RoHS状态

符合RoHS标准