Samsung Electronics M393A4K40BB0-CPB00

ECCN (US)

EAR99

Module

DRAM模块

Module Density

32Gbyte

Number of Chip per Module

36

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2133

Chip Configuration

2Gx4

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

2341

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

CAS Latency

15

SPD EEPROM Support

无

Standard Package Name

BGA

Supplier Package

FBGA

Mounting

表面贴装

Package Length

11

Package Width

7.5

PCB changed

78

Lead Shape

Ball

零件状态

Unconfirmed

引脚数量

78

组织结构

4Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM

RoHS状态

符合RoHS标准