Samsung Electronics M393A4K40BB2-CTD6Q

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Lead Shape

No Lead

PCB changed

288

Package Width

4.3(Max)

Package Length

133.35

Package Height

31.25

Mounting

Socket

Supplier Package

RDIMM

Standard Package Name

DIM

SPD EEPROM Support

无

CAS Latency

19

Number of Ranks

Dual

ECC Support

有

Module Sides

Double

Operating Current (mA)

2827

Maximum Operating Supply Voltage (V)

1.26

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Supply Voltage (V)

1.14

Chip Package Type

78FBGA

Chip Configuration

2Gx4

Maximum Clock Rate (MHz)

2666

Data Bus Width (bit)

72

Chip Density (bit)

8G

Number of Chip per Module

36

Module Density

32Gbyte

零件状态

活跃

引脚数量

288

组织结构

4Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM

RoHS状态

符合RoHS标准