Samsung Electronics M393AAK40B41-CTC0Y

HTS

8473.30.11.40

Module

DRAM模块

Module Density

128Gbyte

Number of Chip per Module

36

Chip Density (bit)

8G

Data Bus Width (bit)

72

Chip Configuration

8Gx4

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Module Sides

Double

ECC Support

无

Number of Ranks

Octal

Number of Chip Banks

16

SPD EEPROM Support

无

零件状态

活跃

组织结构

16Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM