Samsung Electronics M393B1G73EB0-CMA

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

18

Chip Density (bit)

4G

Data Bus Width (bit)

72

Max. Access Time (ns)

20

Maximum Clock Rate (MHz)

670

Chip Configuration

512Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1390

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

CAS Latency

13

SPD EEPROM Support

有

Standard Package Name

DIMM

Supplier Package

RDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

Lead Shape

No Lead

零件状态

活跃

引脚数量

240

组织结构

1Gx72

锁相环

无

自我刷新

有

模块类型

240RDIMM

RoHS状态

符合RoHS标准