Samsung Electronics M393B2G70DB0-YH9

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

36

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1333

Chip Configuration

1Gx4

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.35

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

CAS Latency

9

Standard Package Name

DIMM

Supplier Package

RDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

2Gx72

模块类型

240RDIMM

RoHS状态

符合RoHS标准