Samsung Electronics M393B5270CH0-CH9

底架

Socket

引脚数

240

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

18

Chip Density (bit)

2G

Data Bus Width (bit)

72

Max. Access Time (ns)

0.255

Maximum Clock Rate (MHz)

1333

Chip Configuration

512Mx4

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

2880

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

有

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

9

SPD EEPROM Support

有

Standard Package Name

DIMM

Supplier Package

RDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

Lead Shape

No Lead

Number of Elements

18

RoHS

Compliant

零件状态

Obsolete

最高工作温度

95 °C

最小工作温度

0 °C

引脚数量

240

工作电源电压

1.5 V

最大电源电压

1.575 V

最小电源电压

1.425 V

访问时间

255 ps

组织结构

512Mx72

最高频率

1.333 GHz

锁相环

无

自我刷新

有

模块类型

240RDIMM

RoHS状态

符合RoHS标准