Samsung Electronics M393B5273DH0-CH9

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

18

Chip Density (bit)

2G

Data Bus Width (bit)

72

Max. Access Time (ns)

0.255

Maximum Clock Rate (MHz)

1333

Chip Configuration

256Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1580

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

9

SPD EEPROM Support

有

Standard Package Name

DIMM

Supplier Package

RDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

512Mx72

锁相环

无

自我刷新

有

模块类型

240DIMM

RoHS状态

符合RoHS标准