Samsung Electronics M470T2864EH3-CE6

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

8

Chip Density (bit)

1G

Data Bus Width (bit)

64

Max. Access Time (ns)

0.45

Maximum Clock Rate (MHz)

667

Chip Configuration

64Mx16

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

428

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

5

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

USODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

Package Width

3.8(Max)

PCB changed

200

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

200

组织结构

128Mx64

锁相环

无

自我刷新

有

模块类型

200SODIMM

RoHS状态

符合RoHS标准