Samsung Electronics M471A1G43DB0-CPB0

ECCN (US)

EAR99

HTS

8542.32.00.71

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

16

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2133

Chip Configuration

512Mx8

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

890

ECC Support

无

Number of Ranks

Dual

CAS Latency

15

Supplier Package

USODIMM

Mounting

Socket

Package Height

30

Package Length

69.6

Package Width

3.7(Max)

PCB changed

260

零件状态

Obsolete

引脚数量

260

组织结构

1Gx64

模块类型

260USODIMM

RoHS状态

符合RoHS标准