Samsung Electronics M471A1G43DB1-CRC00

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

16

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2400

Chip Configuration

512Mx8

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Dual

CAS Latency

17

Supplier Package

SODIMM

Mounting

Socket

PCB changed

260

引脚数量

260

组织结构

1Gx64

模块类型

204USODIMM