Samsung Electronics M471A5244CB0-CRC

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

8

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2400

Chip Configuration

512Mx16

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Single

CAS Latency

17

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

69.6

Package Width

3.7(Max)

PCB changed

260

Lead Shape

No Lead

零件状态

活跃

引脚数量

260

组织结构

512Mx64

模块类型

260SODIMM

RoHS状态

符合RoHS标准