Samsung Electronics M471B1G73DB0-YK0

ECCN (US)

EAR99

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

16

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Typical Operating Supply Voltage (V)

1.35

ECC Support

无

Number of Ranks

Dual

CAS Latency

11

SPD EEPROM Support

无

Supplier Package

USODIMM

Mounting

Socket

PCB changed

204

零件状态

Obsolete

引脚数量

204

组织结构

1Gx64

锁相环

无

自我刷新

无

模块类型

204USODIMM

RoHS状态

符合RoHS标准