Samsung Electronics M471B5173DB0-YK0

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

8

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.35

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Single

CAS Latency

11

Standard Package Name

DIM

Supplier Package

USODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

Package Width

3.8(Max)

PCB changed

204

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

204

组织结构

512Mx64

模块类型

204USODIMM

RoHS状态

符合RoHS标准