Samsung Electronics M471B5773DH0-CH900

ECCN (US)

4A994.a

HTS

8542.32.00.71

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

8

Chip Density (bit)

2G

Data Bus Width (bit)

64

Max. Access Time (ns)

0.255

Maximum Clock Rate (MHz)

1333

Chip Configuration

256Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

640

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

9

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

USODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

Package Width

3.8(Max)

PCB changed

204

Lead Shape

No Lead

RoHS

Compliant

零件状态

Obsolete

引脚数量

204

组织结构

256Mx64

锁相环

无

自我刷新

有

模块类型

204USODIMM

RoHS状态

符合RoHS标准