Samsung Electronics M474A1G43DB1-CRC000

ECCN (US)

EAR99

HTS

8542.32.00.71

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

18

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2400

Chip Configuration

512Mx8

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

1100

ECC Support

有

Number of Ranks

Dual

CAS Latency

17

Supplier Package

USODIMM

Mounting

Socket

Package Height

30

Package Length

69.6

Package Width

3.7(Max)

PCB changed

260

零件状态

Obsolete

引脚数量

260

组织结构

1Gx72

模块类型

260USODIMM