Samsung Semiconductor K3RG2G20BM-AGCH0

表面安装

YES

终端数量

272

Manufacturer Part Number

K3RG2G20BM-AGCH0

Part Life Cycle Code

活跃

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

BGA,

Risk Rank

5.75

Number of Words

536870912 words

Number of Words Code

512000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

RECTANGULAR

Package Style

网格排列

Supply Voltage-Nom (Vsup)

1.8 V

端子位置

BOTTOM

终端形式

BALL

功能数量

1

Reach合规守则

compliant

JESD-30代码

R-PBGA-B272

温度等级

OTHER

端口的数量

1

操作模式

ASYNCHRONOUS

组织结构

512MX64

内存宽度

64

记忆密度

34359738368 bit

内存IC类型

DDR DRAM