Samsung Semiconductor K4B2G1646E-BCK0T

表面安装

YES

终端数量

96

Manufacturer Part Number

K4B2G1646E-BCK0T

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA, BGA96,9X16,32

Risk Rank

5.84

Access Time-Max

0.225 ns

Clock Frequency-Max (fCLK)

800 MHz

Number of Words

134217728 words

Number of Words Code

128000000

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA96,9X16,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

1.5 V

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B96

资历状况

不合格

电源

1.5 V

温度等级

OTHER

电源电流-最大值

0.176 mA

组织结构

128MX16

输出特性

3-STATE

内存宽度

16

待机电流-最大值

0.01 A

记忆密度

2147483648 bit

I/O类型

COMMON

内存IC类型

DDR DRAM

刷新周期

8192

顺序突发长度

8

交错突发长度

8