Samsung Semiconductor K4H280438C-TCB00

表面安装

YES

终端数量

136

Manufacturer Part Number

K4H280438C-TCB00

Rohs Code

无

Part Life Cycle Code

活跃

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA, BGA136,12X17,32

Risk Rank

5.83

Access Time-Max

0.75 ns

Clock Frequency-Max (fCLK)

133 MHz

Moisture Sensitivity Levels

3

Number of Words

33554432 words

Number of Words Code

32000000

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA136,12X17,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

2.5 V

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B136

资历状况

不合格

电源

2.5 V

温度等级

COMMERCIAL

电源电流-最大值

0.315 mA

组织结构

32MX4

输出特性

3-STATE

内存宽度

4

待机电流-最大值

0.004 A

记忆密度

134217728 bit

I/O类型

COMMON

内存IC类型

DDR DRAM

刷新周期

4096

顺序突发长度

2,4,8

交错突发长度

2,4,8