Samsung Semiconductor K4X51163PK-FGD80

表面安装

YES

终端数量

60

Manufacturer Part Number

K4X51163PK-FGD80

Part Life Cycle Code

活跃

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

BGA,

Risk Rank

5.73

Number of Words

33554432 words

Number of Words Code

32000000

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

RECTANGULAR

Package Style

网格排列

Supply Voltage-Nom (Vsup)

1.8 V

端子位置

BOTTOM

终端形式

BALL

功能数量

1

Reach合规守则

compliant

JESD-30代码

R-PBGA-B60

端口的数量

1

操作模式

SYNCHRONOUS

组织结构

32MX16

内存宽度

16

记忆密度

536870912 bit

内存IC类型

DDR DRAM