Samsung Semiconductor KLM4G1FE3B-B0010

表面安装

YES

终端数量

153

Manufacturer Part Number

KLM4G1FE3B-B0010

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

VFBGA,

Risk Rank

5.64

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B153

温度等级

OTHER

座位高度-最大

1 mm

内存IC类型

闪存卡

编程电压

3 V

长度

13 mm

宽度

11.5 mm